In a nutshell:
• 32nd FED Conference with presentation of the PCB Design Awards in three categories
• ROSEN colleague Udo Cochet wins prize in the ‘3D/Construction Space’ category
• Award for design of a data acquisition unit
• Limited space required precise, space-saving arrangement of the electronics
• Strategic placement ensures particularly efficient use of the space
As part of the 32nd FED Conference in Ulm, the ‘Fachverband Elektronikdesign und -fertigung’ (FED) presented the prestigious PCB Design Awards for the seventh time. The award recognizes component designers for excellent work in three different categories. Our colleague Udo Cochet (PCB Designer) was honored by the jury in the category ‘3D/Construction Space’. Congratulations!
Special requirements for the construction space
Udo has designed a data acquisition unit consisting of four stacked components, which is used in our inspection tools. It is used to record and store sensor data on anomalies and defects. The data acquisition unit is integrated into a modular, electromechanical system and therefore has clear mechanical specifications, which meant special requirements for the PCB design in terms of construction space.
Space-saving and manufacturable
On the one hand, the entire electronics had to be accommodated in a given space. Secondly, when placing the components in the design, it was important to avoid component collisions, to comply with the design rules for high-speed lines (impedances) and to ensure that heat could be dissipated to the tool housing via aluminum profiles between the PCBs. In addition, the PCB structure had to be realized as cost-effectively as possible and the manufacturability of the assembly in our placement system had to be guaranteed.
Overcoming challenges through good cooperation
"There was a lot to consider with this component and the design repeatedly presented me with challenges. So I'm all the more pleased that we were successful in the end and even won an award," reports Udo. "The assembly was made possible in particular thanks to the excellent collaboration with our Hardware Developers from the Mechanical Design department. Many thanks for the support and to the whole team!"
The limited installation space within the module required a precise and space-saving arrangement of the electronics. According to the FED jury, strategic placement and innovative and clever thermal management ensured particularly efficient use of the construction space.
Breaking new ground
ROSEN Chief Technology Officer Markus Brors also praised the achievement: "Congratulations to everyone involved! I am very impressed by the creative approach to tackling these complex challenges. The result proves once again that our investments in research and development produce valuable solutions that make us even better and more efficient. With this approach, we will continue to be successful and break new ground in the future."
Photos: © Pia Simon photography
About PCB Design
PCB (Printed Circuit Board) design is a crucial step in electronics development that enables the physical realization of a circuit. This involves the arrangement of components and the connection through conductive paths in order to transmit electrical signals. A key challenge is to design the circuit in such a way that problems such as signal interference, electromagnetic compatibility (EMC) and thermal stress are avoided. In high-frequency circuits in particular, the conductor paths must be precisely dimensioned and positioned to minimize signal losses.
An important aspect of PCB design is the selection of the right trace thicknesses, which must be able to withstand both the electrical requirements (e.g. for high currents) and the thermal loads. Thin traces can lead to overheating when overloaded, while traces that are too thick affect the available space and the complexity of manufacturing.
Mechanical challenges also play a significant role, especially when integrating the PCB into the housing. The design must take into account both the physical dimensions and the stability of the PCB in order to withstand mechanical stresses such as vibrations or bending. In addition, the PCB must be optimized for manufacturing so that it can be reliably processed in the assembly process.
Close coordination with manufacturing and purchasing is required, as the selection of components, the availability of materials and the manufacturing processes influence the design. Design for Testability (DFT) and Design for Manufacturability (DFM) also play an important role in ensuring that the PCB can be easily tested and efficiently manufactured.
About the PCB Design Award
The ‘Fachverband Elektronikdesign und -fertigung’ (FED) presented the PCB Design Awards 2024 at its annual conference. Every two years, the prize sponsored by the FED recognizes component designers for excellent work in the categories ‘3D/Construction Space’, ‘High Power’ and ‘High Density’. PCB designers from Germany, Austria and Switzerland can apply with their work. A jury of six experts will evaluate the designs based on technical standards, manufacturability and documentation. The next PCB Design Award will take place in 2026. More information about the PCB Design Award can be found at www.pcb-design-award.de.
About the FED Conference
The 32nd FED Conference, the central industry meeting for electronics design and manufacturing professionals, took place on September 18 to 19 in Ulm. 320 specialists, industry experts and decision-makers from the electronics industry came together to discuss the latest trends and innovations.
About the ‚Fachverband Elektronikdesign und -fertigung (FED) e. V.‘
The FED represents the interests of 700 members. The members of the association are PCB designers and manufacturers, EDA and EMS companies, suppliers of production equipment, software and consumables, process and technology service providers. The FED provides its members with guidance and support for technical business processes and decisions. The association's work focuses on the preparation and dissemination of specialist knowledge and the in-service qualification of electronics designers and electronics specialists.